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新材料科技與化學(xué)技術(shù)創(chuàng)新

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Dow Electronic Materials Introduces New Metallization and Imaging Products for Printed Circuit Boards

Unique Technology Helps Create Smaller, More Sustainable, Less Expensive Consumer Electronics.

發(fā)布時(shí)間:

2022-03-07

Crodateric CYAP Sodium Capryloamphopropionate辛酰兩性基丙酸鈉

CRODATERIC CYAP-LQ-AP是一種低泡沫、可生物降解的兩性表面活性劑，在高溫或者低溫酸性或者堿性的洗滌劑中有極好的去垢性，當(dāng)在酸性或者堿性的噴霧罐有泡沫時(shí)，該產(chǎn)品可以很快打破泡沫的堆積，這一特性使該產(chǎn)品廣泛用于室內(nèi)、室外的地毯、硬表面清洗領(lǐng)域。

發(fā)布時(shí)間:

2021-04-25

Copper Gleam? HV-101 & HV-606 Electrolytic Copper

Copper Gleam??HV-101 and HV-606 electrolytic coppers are the latest offerings for panel plating in Vertical-in-Line equipment. They deliver high plating efficiency to improve productivity and reduce cost.

發(fā)布時(shí)間:

2022-03-07

Copper Gleam? HS-200 Electrolytic Copper from Dupont Dow Rhom Hass Company

The Copper Gleam? HS-200 bath is a full bright acid copper plating process specifically formulated for use in conveyorized plating equipment with insoluble anode. Formulated for high current density plating, the process is capable of producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.

發(fā)布時(shí)間:

2022-03-07

Circuposit? 3000-1 from Dupont Dow Rhom Hass Company

Circuposit??3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.

發(fā)布時(shí)間:

2022-03-07

BS-5烷基二甲基氯化銨與二氧化硫共聚的季銨鹽表面活性劑

酸性鍍銅中間體。烷基二甲基氯化銨與二氧化硫共聚的季銨鹽，陽(yáng)離子型。應(yīng)用于生產(chǎn)酸性鍍銅光亮劑用做主整平劑（LEVELER），可以有效降低HCD（高電流密度區(qū)）沉積速率，提高LCD（低電流密度區(qū)）沉積速率。能增進(jìn)鍍銅的均勻度，有效提高鍍銅光亮性，添加量少，性?xún)r(jià)比高，可配制成高效光亮低應(yīng)力的鍍銅光亮劑。環(huán)保型材料，建議在光劑產(chǎn)品中添加 5-10 G/L 。?

發(fā)布時(shí)間:

2021-01-03

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